40 v , 80 a, 4.1 m low r ds(on) n ch trench power mosfet s ki 04044 ski 04044 - ds rev. 1.3 sanken electric co.,ltd. 1 may. 22, 2 01 4 features ? v (br) dss -------------------------------- - 4 0 v (i d = 100 a) ? i d -------------------------------- -------------------------- 80 a ? r ds ( on ) ---------- 5 . 2 m max . (v gs = 10 v , i d = 42.8 a) ? q g ------ 16.0 nc (v gs = 4.5 v, v ds = 2 0 v , i d = 42.8 a ) ? low total g ate charge ? high speed switching ? low on - resistance ? capable of 4.5 v gate drive ? 100 % uil t ested ? rohs compliant applications ? dc - dc converters ? synchronous rectification ? power supplies package to - 2 63 not to scale equivalent circuit absolute maximum ratings ? unless otherwise specified, t a = 25 c parameter symbol test conditions rating unit drain to source voltage v ds 4 0 v gate to source voltage v gs 20 v continuous drain current i d t c = 25 c 80 a pulsed drain current i dm pw 100s duty cycle 1 % 161 a continuous source current (body diode) i s 80 a pulsed source current (body diode) i sm pw 100s duty cycle 1 % 161 a single pulse avalanche energy e as v dd = 20 v, l = 1 mh, i as = 9.4 a, unclamped, r g = 4.7 , refer to figure 1 89 mj avalanche current i as 16.7 a power dissipation p d t c = 25 c 90 w operating junction temperature t j 150 c storage temperature range t stg ? (1) (2) (3) g d s http://www.sanken - ele.co.jp ( 4 ) d d ( 2 ) ( 4 ) s ( 3 ) g ( 1 )
s ki 04044 ski 04044 - ds rev. 1.3 sanken electric co.,ltd. 2 may. 22, 2 01 4 thermal characteristics ? unless otherwise specified, t a = 25 c parameter symbol test conditions m in . t yp . m ax . unit thermal resistance ( junction to case ) r jc ? ? junction to ambient ) r ja ? ? electrical characteristics ? unless otherwise specified, t a = 25 c parameter symbol test conditions m in . t yp . m ax . unit drain to source breakdown voltage v (br) dss i d = 100 a, v gs = 0 v 4 0 ? ? dss v ds = 4 0 v, v gs = 0 v ? ? gss v gs = 20 v ? ? gs( th ) v ds = v gs , i d = 650 a 1.0 2.0 2.5 v static drain to source on - resistance r ds( on ) i d = 42.8 a, v gs = 10 v ? m i d = 21.4 a, v gs = 4.5 v ? m g f = 1 mhz ? ? iss v ds = 25 v v gs = 0 v f = 1 mhz ? ? oss ? ? rss ? ? gs = 10 v) q g1 v ds = 20 v i d = 42.8 a ? ? gs = 4.5 v) q g2 ? ? gs ? ? gd ? ? d(on) v dd = 20 v i d = 42.8 a v gs = 10 v, r g = 4.7 refer to figure 2 ? ? r ? ? d(off) ? ? f ? ? v sd i s = 42.8 a, v gs = 0 v ? t rr i f = 42.8 a di/dt = 100 a/s refer to figure 3 ? ? rr ? ?
s ki 04044 ski 04044 - ds rev. 1.3 sanken electric co.,ltd. 3 may. 22, 2 01 4 test circuit s and waveform s (a) test circuit ( b ) waveform figure 1 unclamped inductive switching (a) test circuit ( b ) waveform figure 2 switching time (a) test circuit ( b ) waveform figure 3 diode reverse recovery time v d d i d v d s r g v g s 0 v l i a s i d v ( b r ) d s s v d d v d s v d s v d d r g r l v g s 0 v p . w . = 1 0 s d u t y c y c l e 1 % t d ( o n ) t r t o n t d ( o f f ) t f t o f f 9 0 % 1 0 % 9 0 % 1 0 % v g s v d s v g s 0 v i f r g l d . u . t . v d d 0 v i f t r r d i / d t i r m 9 0 % i r m dd (br)dss (br)dss 2 as as v v v i l 2 1 e ? ? ? ? ?
s ki 04044 ski 04044 - ds rev. 1.3 sanken electric co.,ltd. 4 may. 22, 2 01 4 0 1 2 3 4 5 6 7 8 9 10 0 20 40 60 80 100 120 140 160 rds(on) (m ) id (a) rds(on) - id characteristics (typical) vgs=10v tc = 125 75 25 0 5 10 15 20 25 0 20 40 60 80 100 120 140 160 rds(on) (m ) id (a) rds(on) - id characteristics (typical) vgs=4.5v tc = 125 75 25 0 20 40 60 80 100 120 140 160 0 1 2 3 4 5 id (a) vgs (v) id - vgs characteristics (typical) vds=5v tc =125 75 25 0.0 0.1 0.2 0.3 0.4 0 5 10 15 vds (v) vgs (v) vds - vgs characteristics (typical) id=21.4a id=35.4a id=42.8a tc=25 0 20 40 60 80 100 120 140 160 0 0.5 1 1.5 idr (a) vsd (v) idr - vsd characteristics (typical) tc=25 vgs=10v vgs=4.5v 3v 0v 0 20 40 60 80 100 120 140 160 0 0.5 1 1.5 idr (a) vsd (v) idr - vsd characteristics (typical) vds=0v tc =125 75 25 10 100 1000 10000 0 10 20 30 40 capacitance (pf) vds (v) capacitance - vds characteristics (typical) ciss coss crss ta=25 vgs=0v f =1mhz 0 5 10 15 0 10 20 30 40 vgs (v) qg (nc) vgs - qg characteristics (typical) tc=25 vds=20v id=42.8a 0 1 2 3 25 50 75 100 125 150 vth (v) tc ( ) vth - tc characteristics (typical) id=650ua vgs=vds 0 2 4 6 8 10 25 50 75 100 125 150 rds on (m ) tc ( ) rds(on) - tc characteristics (typical) id=42.8a vgs=10v 0 2 4 6 8 10 12 25 50 75 100 125 150 rds on (m ) tc ( ) rds(on) - tc characteristics (typical) id=21.4a vgs=4.5v 42 44 46 48 50 52 25 50 75 100 125 150 bvdss (v ) tc ( ) bvdss - tc characteristics (typical) id=1ma vgs=0v
s ki 04044 ski 04044 - ds rev. 1.3 sanken electric co.,ltd. 5 may. 22, 2 01 4 0 20 40 60 80 100 0 50 100 150 (w) ta ( ) pd - ta derating 0.1 1 10 100 1000 0.1 1 10 100 id (a) vds (v) safe operating area pt=100s id(pulse) max pt=1ms 1 shot tc=25 1.e - 02 1.e - 01 1.e+00 1.e+01 1.e - 04 1.e - 03 1.e - 02 1.e - 01 1.e+00 1.e+01 1.e+02 rth j - c ( /w) p.t. (sec) transient thermal resistance - pulse width tc = 25 1shot vds < 10v
s ki 04044 ski 04044 - ds rev. 1.3 sanken electric co.,ltd. 6 may. 22, 2 01 4 p ackage outline notes: 1) dimension is in millimeters 2) pb - free. device composition compliant with the rohs directive marking diagram to - 263 part number ymw baa ski lot number y is the l ast di git of the y ear ( 0 to 9 ) m is the month ( 1 to 9 , o , n or d ) w is the week ( 1 st to 5 th week of every month ) b e xpresses pb free p ins a is the s uffix no .
s ki 04044 ski 04044 - ds rev. 1.3 sanken electric co.,ltd. 7 may. 22, 2 01 4 operating precautions in the case that you use sanken products or design your products by using sanken products, the reliability largely depends on the degree of derating to be made to the rated values. derating may be interpreted as a case that an operati on range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. in general, derating factors include electric stresses such as electric voltage, electric current , electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self - heating of semiconductor products. for these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. in addition, it should be noted that since power devices or ics including power devices have large self - heating value, the degree of derating of junction temperature affects the reliability significantly. because reliability can be affect ed adversely by improper storage environments and handling methods, please observe the following cautions. cautions for storage ? ensure that storage conditions comply with the standard temperature (5 to 35c) and the standard relative humidity (around 40 to 75%) ; avoid storage locations that experience extreme changes in temperature or humidity. ? avoid locations where dust or harmful gases are present and avoid direct sunlight. ? reinspect for rust on leads and solderability of the products that have been store d for a long time. cautions for testing and handling when tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between the product pins, and wrong connection s. ensure all test parameters are within the ratings specified by sanken for the product s . remarks about using thermal silicone grease ? when thermal silicone grease is used, it shall be applied evenly and thinly. if more silicone grease than required is a pplied, it may produce excess stress. ? the thermal silicone grease that ha s been stored for a long period of time may cause cracks of the greases , and it cause low radiation performance. in addition, the old grease may cause cracks in the resin mold when sc rewing the products to a heatsink. ? fully consider preventing foreign mat erials from entering into the thermal silicone grease. when foreign mat erial is immixed, radiation performance may be degraded or an insulation failure may occur due to a damaged insul ating plate. ? the thermal silicon e greases that are recommended for the resin molded semiconductor should be used. our recommended thermal silicone grease is the following, and equivalent of these. type suppliers g746 shin - etsu chemical co., ltd. yg6260 momentive performance materials japan llc sc102 dow corning toray co., ltd. soldering when soldering the products, please be sure to minimize the working time, within the following limits: ? reflow preheat ; 180 c / 9 0 30 s solder heating ; 250 c / 10 1s (260 c peak, 2 times) ? soldering iron ; 380 10 c / 3 .5 0.5 s ( 1 time ) electrostatic discharge ? when handling the products, the operator must be grounded. grounded wrist straps wor n should have at least 1m of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator. ? workbenches where the products are handled should be gro unded and be provided with conductive table and floor mats. ? whe n using measuring equipment such as a curve tracer, the equipment should be grounded. ? when soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent leak voltages generated by them from being applied to the products. ? the products should always be stored and transported in sanken shipping containers or conductive containers, or be wrapped in aluminum foil.
s ki 04044 ski 04044 - ds rev. 1.3 sanken electric co.,ltd. 8 may. 22, 2 01 4 important notes ? the contents in this document are subject to changes, for improvement and other purpos es, without notice. make sure that this is the latest revision of the document before use. ? application examples, operation examples and r ecommend ed example s described in this document are quoted for the sole purpose of reference for the use of the products herein and sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights , life , body, property or any other rights of sanken or any third party which may result from its use. ? unless otherwise agreed i n writing by sanken, sanken makes no warranties of any kind, whether express or implied, as to the products, including product merchantability, and fitness for a particular purpose and special environment, and the information, including its accuracy, usefu lness, and reliability, included in this document. ? although sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. users of sanken products a re requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. ? sanken products listed in this docu ment are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). when considering the use of sanken products in the a pplications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest sanken sales representative to discuss, prior to the use of the products herein. the use of sanken products without the written consent of sanken in the applications where extre mely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. ? when using the products specified herein by either (i) combining other products or materials therewith or (ii) physic ally, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. ? anti radioactive ray design is not considered for the products listed herein. ? sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of sankens distribution network. ? the contents in this document must not be transcribed or copied without sankens writte n consent.
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